Flexible Technology Ltd Capabilities
Please Note : This is a general list our capabilities, for special requirements, please contact us.
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Material Selection |
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Polyimide Films |
0.5 mil (12.5 µm), 1 mil (25 µm), 2 mil (50 µm), 3 mil (75 µm), 5 mil (125 µm) |
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Thermobond Adhesives |
Acrylic, Modified Acrylic, Epoxy, Modified Epoxy, Polyimide |
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Copper Foils (RA or ED) |
0.25oz (9 µm), 0.5oz (18 µm), 1oz (35 µm), 2 oz (70 µm), up to 10oz(350 µm) |
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Stiffeners |
Polyimide, FR4 Rigids, Metal or customer supplied |
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FR4 in multilayer Flexible PCB's |
IS410, FR4, 370HR |
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Surface Finish |
H.A.S.L, Immersion Sterling Silver, Immersion and Electrolytic Gold, Palladium,
Lead Free Solder (SN100C), Organic. |
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Adhesive Tapes |
3M Transfer Adhesive |
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Solder Resist |
Liquid Photo-Imagable Soldermasks and Coverlays |
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Other Materials or Finishes |
Please contact us for any special requirements. |
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Printing Definition Capabilities and Tolerances |
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Minimum Track and Gap |
0.1 mm Track and 0.1 mm Gap (1oz Copper) |
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Minimum Space Between Coverlay Aperture Edges |
0.2 mm |
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Coverlay Aperture Edge to Track |
0.2 mm |
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Minimum Legend Line Width |
0.2 mm |
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Drill Capabilities |
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Drill Aspect Ratio |
5:1 |
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Smallest Drill Size |
0.2 mm |
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Largest Drill Size |
6.5 mm (Larger Holes Routed) |
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Smallest Slot Width |
0.5 mm |
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Micro Via Capability |
Please Discuss with Engineering |
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Fabrication Tolerances |
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Minimum Track to Routed Edge Gap |
+/- 0.15 mm |
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Minimum Track to Soft Tooled Edge Gap |
+/- 0.30 mm |
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Minimum Track to Hard Tooled Edge Gap |
+/- 0.15 mm |
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Dimensional Tolerance of Routed Circuit |
+/- 0.10 mm |
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Dimensional Tolerance of Soft Tooled Circuit |
+/- 0.25 mm |
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Dimensional Tolerance of Hard Tooled Circuit |
+/- 0.10 mm |
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Minimum Internal Radius of Routed Circuit |
0.30 mm |
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Minimum Internal Radius of Soft Tooled Circuit |
0.80 mm |
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Minimum Internal Radius of Hard Tooled Circuit |
0.50 mm |
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Miscellaneous |
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Maximum Layer to Layer Mis-registration for Double Sided |
0.10 mm |
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Maximum Layer to Layer Mis-registration for Multilayer |
0.25 mm |
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Copper Plating Thickness |
As Per Customer Requirement |
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Maximum Number of Copper Layers Built |
30 |
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Maximum Panel Size |
Dependant Upon Circuit Design |
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Capability
